PCB Fabrication

Canadian PCB manufacturing specializing in high-reliability FR-4 printed circuit board fabrication. Supports prototype through volume production aligned to IPC Class 2 and Class 3 standards.

• Single-sided and double-sided PCBs
• Multilayer PCB fabrication
• Prototype and production builds
• Standard FR-4, high-TG FR-4, halogen-free, and low-CTE laminates
• Materials from Isola, Nanya, Ventec, Nelco, Panasonic, and Shengyi
• ITAR compliant, Canadian CGP registered
• Secure data handling and controlled documentation

High-reliability multilayer PCB fabrication for complex, high-density electronic designs. Manufactures 3 to 32 layer PCBs using advanced lamination and controlled dielectric spacing.

• 4-32 layer construction
• Impedance-controlled stack-ups
• Advanced sequential lamination
• Engineering support for stack-up and material selection
• Automated Optical Inspection (AOI) and electrical testing
• IPC and ISO-compliant manufacturing

Specializes in HDI PCB fabrication, enabling miniaturization without compromising performance for smartphones, wearables, high-speed computing, and advanced electronics.

• Via-in-Pad, blind, and buried vias
• Fine line trace widths and high layer count stack-ups
• Sequential lamination and ultra-thin dielectric layers
• Laser Direct Imaging (LDI)
• X-ray and vision-controlled drilling
• TDR test coupons on each panel
• Stack-up and impedance modeling software

Integrates multiple substrate materials (FR4, PTFE, ceramic-filled laminates, polyimide) to achieve specialized electrical, thermal, and mechanical performance.

• Multi-material stack-ups for RF, thermal, and mechanical optimization
• CTE matching and controlled lamination cycles
• Material compatibility checks
• Aerospace and high-performance electronics applications
• Controlled press-cycle temperature and pressure profiles
• Optimized heat-up rates, pressure ramps, and dwell times

Versatile solutions for dynamic, compact, and high-reliability applications.

• Single-layer, double-layer, and multilayer flex circuits
• Rigid-flex boards combining durability with adaptability
• High-quality polyimide materials for repeated bending
• Optimized bend areas, stiffener placement, and layer transitions
• Aerospace, medical devices, wearable technologies
• Tight bend radii and lightweight packaging options

High-performance boards for high-frequency signal transmission with minimal loss.

• PTFE, ceramic-filled, and low-loss dielectric materials
• Controlled-impedance processes and tight-tolerance etching
• Frequencies from MHz to multi-GHz
• Radar, wireless communication, satellite equipment
• High-frequency laminates from Rogers, Arlon, Taconic, Panasonic, Ventec
• Fluoro-etch cleaning and plasma etching for surface preparation

Heavy Copper PCB
Fabrication for high-current, high-temperature, and mechanically demanding applications.

• Copper thickness greater than or equal to 3 oz, including differential copper builds
• Specialized plating, controlled etching, and precision lamination
• High-current routing alongside low-power control circuitry
• Power electronics, automotive systems, industrial controls
• Handles elevated temperatures and mechanical stress

Superior thermal management for high-power electronics.

• Aluminum or copper base for rapid heat dissipation
• Single-layer and multi-layer MCPCBs
• LED lighting, automotive electronics, power modules
• High-quality laminates from Ventec, Henkel, Bergquist Thermal Clad
• Supports up to 8 oz copper

Integrates components directly into internal layers for compact, high-performance designs.

• Embedded resistors, capacitors, and active devices
• Reduced board size and solder joints
• Improved signal integrity and reliability
• Medical devices, aerospace, high-performance computing
• Collaboration with Ohmega Technologies for embedded-resistor technology