Quality Assurance
From complex PCB fabrication to integrated assembly support, Canadian Circuits delivers the capabilities needed to move projects from design through production with confidence.
Verified performance at every level
Reliable PCBs, Built for Long-Term Performance
Printed Circuit Boards are critical components of electronic devices, and it is important that they function flawlessly throughout the lifetime of a device. At Canadian Circuits, every PCB is carefully monitored and inspected throughout manufacturing to help prevent errors and ensure consistent, high-quality results.
Our Quality Assurance system complies with ISO 9001:2015 and IPC 6012 Class 1, 2, and 3 standards.
Our quality assurance program:
Every PCB we manufacture goes through a rigorous inspection and testing process to ensure accuracy, reliability, and long-term performance. Quality is built into every stage of production.
Tooling and DFM Assistance
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- Review of Gerber files, fabrication drawings, drill data, BOMs, and assembly files
- DFM and DFA checks to identify potential production issues
- Verification of component footprints, polarity, orientation, and placement data
- Check plots provided for customer approval before PCB production
Glenbrook 3D X-Ray Inspection
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- High-resolution, non-destructive inspection of assembled circuit boards
- Detects hidden solder defects, including voids, bridges, opens, and insufficient solder
- Ideal for inspecting BGAs, micro-BGAs, QFNs, and other bottom-terminated components
- Multi-angle imaging and void measurement support accurate analysis and process control
Automated Optical and X-Ray Inspection
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- AOI inspection for opens, shorts, and PCB circuitry defects
- AOI verification of missing, incorrect, reversed, or misaligned components
- Detection of solder bridges and insufficient or excessive solder
- X-ray inspection of hidden solder joints beneath BGAs and QFNs
Testing and Measurement
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- 100% electrical testing of bare PCBs for opens and shorts
- Component value, polarity, orientation, and placement verification for assembled boards
- Testing using customer-provided software, firmware, procedures, and test fixtures
- Microsection and controlled-impedance testing when required
Quality Records and Traceability
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- PanaCIM MES software supports material control and verification, product changeovers, component traceability, production monitoring, and performance analysis.
- Manufacturing, inspection, and testing records are maintained throughout production.
- Material, component, lot, date-code, and product-revision traceability is maintained.
- Certificates of Conformance, test reports, and material certifications are available upon request.
For us, quality is a continuous commitment
Our state-of-the-art quality testing machine line-up gives us the capability to produce high quality circuit boards. View QA and Testing Machines below:
Microcraft E-Tester
MicroCraft’s EMMA has been one of the best fixtureless flying probe bare board testing machines as we can achieved high speed and accurate e-testing of the PCB Boards. Before shipping out the final boards to our customer, we e-test them 100% without any additional cost.
Camtec Orion AOI System
We have recently upgraded the Quality Assurance capability by installing Camtec Orion AOI (Automated Optical Inspection) system. The system combines both scanning and verification of different varieties of materials in various stages of the production. This AOI system helps in implementing Preventive Action to the production system as well inspect the quality of the product.
AAS Atomic Absorption Spectrometry
Atomic absorption spectroscopy (AAS) is a procedure for the quantitative determination of chemical elements using the absorption of optical radiation (light) by free atoms in the gaseous state based on absorption of light by free metallic ions. We use PerkinElmer’s Atomic Absorption Spectroscopy to analyse our processes for process parameters control.
Zmatrix TDR
Time Domain Reflectometer (TDR) impedance measurements are essential for ensuring signal integrity in a PCB design. TDR feeds a pulse onto the PCB trace/transmission line on a test coupon and measures the characteristic impedance by analyzing the changes in the amplitude of the reflected waveform. We use Zmatrix TDR to measure the impedance coupon.
SEIKO CMI-XRF
X-Ray Flouroscence spectroscopy (XRF) is a non-destructive, contact free coating thickness measurement and materials analysis. Our Quality Team measures coating of Gold, Nickel, Silver and SnPb with the help of Seiko CMI-XRF spectroscope.
Cross Section Analysis
The cross-section analysis is a destructive analysis that measures the internal quality of the fabricated board. Our manufacturing facility is equipped with various fixtures and equipment to make the coupon and to identify any internal defects using micro-section of PCB.






